MICROCHIP SP1F, SP3F Power Module

Zofotokozera

• Product: SP1F and SP3F Power Modules
• Chithunzi cha AN3500
• Application: PCB Mounting and Power Module Mounting

Mawu Oyamba

Cholemba ichi chimapereka malingaliro akulu kuti mulumikize moyenerera bolodi losindikizidwa (PCB) ku SP1F kapena gawo lamagetsi la SP3F ndikuyika gawo lamagetsi pa sinki ya kutentha. Tsatirani malangizo okweza kuti muchepetse kupsinjika kwa kutentha ndi makina.

PCB Mounting Malangizo

• The PCB mounted on the power module can be screwed to the standoffs to reduce all mechanical stress and minimize relative movements on the pins that are soldered to the power module. Step 1: Screw the PCB to the standoffs of the power module.
  
• A self-tapering pulasitiki wononga ndi awiri mwadzina 2.5 mm tikulimbikitsidwa kuti angagwirizanitse PCB. Zomangira za pulasitiki, zomwe zikuwonetsedwa pachithunzi chotsatirachi, ndi mtundu wa zomangira zomwe zimapangidwira kuti zigwiritsidwe ntchito ndi pulasitiki ndi zida zina zotsika kwambiri. Kutalika kwa screw kumadalira makulidwe a PCB. Ndi PCB yokhuthala 1.6 mm (0.063”), gwiritsani ntchito pulasitiki 6 mm (0.24”) yaitali. Makokedwe okwera kwambiri ndi 0.6 Nm (5 lbf·in). Yang'anani kukhulupirika kwa positi ya pulasitiki mutatha kulimbitsa zomangira.
  
• Gawo 2: Solder all electrical pins of the power module to the PCB as shown in the following figure. A no-clean solder flux is required to attach the PCB, as the aqueous module cleaning is not allowed.
  

Zindikirani: 

• Osasintha masitepe awiriwa, chifukwa ngati zikhomo zonse zimagulitsidwa koyamba ku PCB, kugwetsa PCB ku standoffs kumapanga mapindikidwe a PCB, zomwe zimatsogolera kupsinjika kwamakina komwe kumatha kuwononga mayendedwe kapena kuswa zigawo pa PCB.
• Mabowo mu PCB monga momwe tawonetsera m'chithunzi chapitachi ndi chofunikira kuti muyike kapena kuchotsa zomangira zomwe zimatsekera gawo la mphamvu ku sinki ya kutentha. Mabowo olowera awa ayenera kukhala akulu mokwanira kuti wononga mutu ndi ma washer kudutsa momasuka, kulola kulolerana kwabwinobwino pamalo a dzenje la PCB. The PCB dzenje awiri kwa zikhomo mphamvu tikulimbikitsidwa pa 1.8 ± 0.1 mm. The PCB dzenje m'mimba mwake poika kapena kuchotsa zomangira zomangira tikulimbikitsidwa pa 10 ± 0.1 mm.
• For efficient production, a wave soldering process can be used to solder the terminals to the PCB. Each application, heat sink and PCB can be different; wave soldering must be evaluated on a case-by-case basis. In any case, a well-balanced layer of solder should surround each pin.
• The gap between the bottom of the PCB and the power module is 0.5 mm to 1 mm only as shown in PCB Mounted on Power Module figure. Using through-hole components on the PCB is not recommended.
• SP1F or SP3F pinout can change according to the configuration. See the product datasheet for more information on the pin-out location.

Malangizo Oyikira Power Module

• Kuyika bwino kwa mbale yoyambira ya module pa sinki yotenthetsera ndikofunikira kuti zitsimikizire kutentha kwabwino. The kutentha lakuya ndi mphamvu gawo kukhudzana pamwamba ayenera kukhala lathyathyathya (analimbikitsa flatness ayenera kukhala zosakwana 50 μm kwa 100 mm mosalekeza, analimbikitsa roughness Rz 10) ndi woyera (palibe dothi, dzimbiri, kapena kuwonongeka) kupewa kupsyinjika makina pamene gawo mphamvu wokwera, ndi kupewa kuwonjezeka kukana matenthedwe.
• Gawo 1: Kupaka mafuta otenthetsera: Kuti mukwaniritse chotsika kwambiri kuti muzitha kukana kutentha kwamafuta, mafuta otenthetsera amayenera kugwiritsidwa ntchito pakati pa gawo la mphamvu ndi sinki ya kutentha. Ndikoyenera kugwiritsa ntchito njira yosindikizira pazenera kuti muwonetsetse kuyika kofanana kwa makulidwe ochepera 60 μm (2.4 mils) pamadzi otentha monga momwe tawonetsera pachithunzichi. Kutentha kwapakati pa module ndi kutentha kwa kutentha kungathenso kupangidwa ndi zipangizo zina zopangira matenthedwe monga kusintha kwa gawo (screen-printed or adhesive layer).
  
• Gawo 2: Kuyika gawo lamagetsi pa sinki ya kutentha: Ikani gawo la mphamvu pamwamba pa mabowo ozama kutentha ndikuyikapo pang'onopang'ono. Ikani sikwala ya M4 yokhala ndi loko ndi zochapira zathyathyathya pabowo lililonse lokwera (#8 screw ikhoza kugwiritsidwa ntchito m'malo mwa M4). Kutalika kwa wononga kuyenera kukhala osachepera 12 mm (0.5"). Choyamba, limbitsani zomangira ziwirizo pang'onopang'ono. Limbitsani zomangirazo mpaka mtengo wake womaliza wa torque ufikire (onani zolemba zamtundu wa torque yayikulu yomwe imaloledwa). Ndikofunikira kugwiritsa ntchito screwdriver yokhala ndi torque yoyendetsedwa bwino. Ngati ndi kotheka, zomangira zitha kumangidwanso pakatha maola atatu. ikangobowoleredwa pansi pa sinki yotenthetsera ndi torque yoyenera yoyikira gawolo liyenera kukhala lonyowa kwathunthu ndi mafuta otenthetsera monga momwe zasonyezedwera mu Gritsi pa Chifaniziro Pambuyo pa Kuchotsa kusiyana pakati pa zomangira, utali wa pamwamba ndi malo oyandikira kwambiri ayenera kuyang'aniridwa kuti asunge malo otetezeka.

 General Assembly View

• Ngati PCB yayikulu ikugwiritsidwa ntchito, ma spacers owonjezera pakati pa PCB ndi choyatsira kutentha ndikofunikira. Ndibwino kuti tisunge mtunda wa osachepera 5 cm pakati pa gawo la mphamvu ndi ma spacers monga momwe tawonetsera pa chithunzichi. Ma spacers ayenera kukhala aatali ofanana ndi zoimilira (12 ± 0.1 mm).
  
• Pazinthu zinazake, ma modules ena a SP1F kapena SP3F amapangidwa ndi AlSiC (Aluminium Silicon Carbide) baseplate (M suffix mu gawo nambala). AlSiC baseplate ndi 0.5 mm thicker kuposa copper baseplate, kotero spacers ayenera kukhala 12.5 ± 0.1 mm mu makulidwe.
• Kutalika kwa chimango chapulasitiki cha SP1F ndi SP3F ndi kutalika kofanana ndi SOT-227. Pa PCB yomweyi, ngati SOT-227 ndi imodzi kapena ma modules amphamvu a SP1F/SP3F okhala ndi baseplate yamkuwa amagwiritsidwa ntchito, ndipo ngati mtunda wapakati pa ma module awiriwa sudutsa 5 cm, sikoyenera kukhazikitsa spacer monga momwe tawonetsera mu chithunzi chotsatira.
• Ngati ma module amphamvu a SP1F/SP3F okhala ndi AlSiC baseplate amagwiritsidwa ntchito ndi SOT-227 kapena ma module ena a SP1F/SP3F okhala ndi mkuwa, kutalika kwa heatsink kuyenera kuchepetsedwa ndi 0.5 mm pansi pa ma module a SP1F/SP3F okhala ndi AlSiC baseplate kuti asunge ma module onse pamtunda womwewo.
• Chisamaliro chiyenera kutengedwa ndi zigawo zolemera monga electrolytic kapena polypropylene capacitors, transformers, kapena inductors. Ngati zigawozi zili m'dera lomwelo, tikulimbikitsidwa kuwonjezera ma spacers ngakhale mtunda pakati pa ma modules awiri sudutsa 5 cm kotero kuti, kulemera kwa zigawozi pa bolodi sikusamalidwe ndi gawo la mphamvu koma ndi spacers. Mulimonsemo, ntchito iliyonse, kutentha kwakuya, ndi PCB ndizosiyana; kuyika kwa spacers kuyenera kuwunikidwa pamutu ndi mlandu.
  

Power Module Dismounting Instructions

To safely remove the power module from the heatsink, perform following steps:

1. On the PCB, remove all screws from the spacers.
2. On the heatsink, remove all screws from the power module mounting holes.
   Chenjezo
   Depending on the thermal interface material, the module baseplates may adhere strongly to the heatsink. Do not pull on the PCB to remove the assembly, as this may damage the PCB or the modules. To prevent damage, detach each module from the heatsink before removal.
3. To safely detach the modules:
   • Insert a thin blade, such as the tip of a flat screwdriver, between the module baseplate and the heatsink.
   • Gently twist the blade to separate the baseplate from the heatsink.
   • Repeat this process for each module mounted to the PCB.

Mapeto
This application note gives the main recommendations regarding the mounting of SP1F or SP3F modules. Applying these instructions helps decrease the mechanical stress on PCB and power module, while ensuring long term operation of the system. Mounting instructions to the heatsink must also be followed to achieve the lowest thermal resistance from the power chips down to the cooler. All these steps are essential to guarantee the best system reliability.

Mbiri Yobwereza
Mbiri yokonzanso ikufotokoza zosintha zomwe zidakhazikitsidwa muzolemba. Zosinthazo zandandalikidwa ndi kubwereza, kuyambira ndi zofalitsa zamakono.

Kubwereza	Tsiku	Kufotokozera
B	10/2025	Zowonjezedwa Power Module Dismounting Instructions.
A	05/2020	Uku ndiye kutulutsidwa koyamba kwa chikalatachi.

Zambiri za Microchip

Zizindikiro

• Dzina ndi logo ya “Microchip”, logo ya “M”, ndi mayina ena, ma logo, ndi mitundu ndi zizindikilo zolembetsedwa ndi zosalembetsedwa za Microchip Technology Incorporated kapena mabungwe ake ndi/kapena mabungwe aku United States ndi/kapena mayiko ena (“Microchip Zizindikiro "). Zambiri zokhuza Zizindikiro za Microchip zitha kupezeka pa https://www.microchip.com/en-us/about/legal-information/microchip-trademarks.
• ISBN: 979-8-3371-2109-3

Chidziwitso chazamalamulo

• Bukuli ndi zambiri zomwe zili pano zitha kugwiritsidwa ntchito ndi zinthu za Microchip zokha, kuphatikiza kupanga, kuyesa, ndi kuphatikiza zinthu za Microchip ndi pulogalamu yanu. Kugwiritsa ntchito chidziwitsochi mwanjira ina iliyonse kumaphwanya mawuwa. Zambiri zokhudzana ndi kugwiritsa ntchito zida zimaperekedwa kuti zitheke ndipo zitha kulowedwa m'malo ndi zosintha. Ndi udindo wanu kuwonetsetsa kuti pulogalamu yanu ikugwirizana ndi zomwe mukufuna. Lumikizanani ndi ofesi yogulitsa za Microchip kwanuko kuti muthandizidwe zina kapena, pezani thandizo lina pa www.microchip.com/en-us/support/design-help/client-support-services.
• ZIMENEZI AMAPEREKA NDI MICROCHIP "MONGA ILI". MICROCHIP SIIPEREKERA ZINTHU KAPENA ZIZINDIKIRO ZA MTIMA ULIWONSE KAYA KUTANTHAUZIRA KAPENA KUTANTHAWIRIKA, KULEMBEDWA KAPENA MWAMWAMBA, MALAMULO KAPENA ZINTHU ZINA, ZOKHUDZANA NDI CHIZINDIKIRO KUPHATIKIZAPO KOMA ZOSAKHALA PA CHENJEZO KILICHONSE, KUTENGA ZIPANGIZO, KUTENGA CHIZINDIKIRO, KUCHITIKA, NTCHITO, NTCHITO. PA CHOLINGA ENA, KAPENA ZINTHU ZOKHUDZA ZOKHUDZANA NDI MKHALIDWE WAKE, UKHALIDWE, KAPENA NTCHITO YAKE.
  PAMENE MICROCHIP IDZAKHALA NDI NTCHITO PA CHIZINDIKIRO CHILICHONSE, CHAPADERA, CHILANGO, ZOCHITIKA, KAPENA ZOTSATIRA ZOTSATIRA, KUonongeka, mtengo, KAPENA NTCHITO ZONSE ZOMWE ZILI ZOKHUDZA CHIdziwitso KAPENA NTCHITO YAKE, KOMA CHIFUKWA CHIFUKWA CHOCHITIKA, ZOCHITIKA KAPENA ZOWONONGWA NDI ZOONERA. KUBWERA KWABWINO KWAMBIRI ZOLOLEZEDWA NDI MALAMULO, NDONDOMEKO YONSE YA MICROCHIP PA ZINSINSI ZONSE MU NJIRA ILIYONSE YOKHUDZANA NDI CHIdziwitso KAPENA KUKGWIRITSA NTCHITO CHOSAPYOTSA KUCHULUKA KWA ZOLIMBIKITSA, NGATI KULIPO, ZIMENE MULIPITSA CHIFUKWA CHIFUKWA CHIFUKWA CHIYANI.
• Kugwiritsa ntchito zipangizo za Microchip pa chithandizo cha moyo ndi / kapena ntchito za chitetezo ndizoopsa kwa wogula, ndipo wogula akuvomera kuteteza, kubwezera ndi kusunga Microchip yopanda vuto lililonse ku zowonongeka, zodandaula, masuti, kapena ndalama zomwe zimachokera ku ntchito yotere. Palibe zilolezo zomwe zimaperekedwa, mobisa kapena mwanjira ina, pansi pa ufulu wazinthu zaukadaulo za Microchip pokhapokha zitanenedwa.

Chitetezo cha Microchip Devices Code
Zindikirani tsatanetsatane wotsatira wa chitetezo cha code pazinthu za Microchip:

• Zogulitsa za Microchip zimakwaniritsa zomwe zili mu Microchip Data Sheet yawo.
• Microchip imakhulupirira kuti katundu wake ndi wotetezeka akagwiritsidwa ntchito m'njira yomwe akufuna, malinga ndi momwe amagwirira ntchito, komanso m'mikhalidwe yabwinobwino.
• Ma Microchip amawakonda ndikuteteza mwamphamvu ufulu wake wazinthu zamaluntha. Kuyesa kuphwanya malamulo otetezedwa ndi zinthu za Microchip ndizoletsedwa ndipo zitha kuphwanya Digital Millennium Copyright Act.
• Ngakhale Microchip kapena wopanga semiconductor wina aliyense sangatsimikizire chitetezo cha code yake. Kutetezedwa kwa ma code sikutanthauza kuti tikutsimikizira kuti chinthucho ndi "chosasweka". Chitetezo cha code chikusintha nthawi zonse. Microchip yadzipereka mosalekeza kuwongolera mawonekedwe achitetezo azinthu zathu.

FAQ

Can I use a wave soldering process for soldering terminals to the PCB?

Yes, a wave soldering process can be used for efficient production. However, evaluate its suitability based on your specific application, heat sink, and PCB requirements.

Is it necessary to install a spacer between power modules?

If the distance between two power modules does not exceed 5 cm and they are mounted on the same PCB with a SOT-227, it is not necessary to install a spacer.

Zolemba / Zothandizira

MICROCHIP SP1F, SP3F Power Module [pdf] Buku la Malangizo SP1F, SP3F, AN3500, SP1F SP3F Power Module, SP1F SP3F, Power Module, Module

Maumboni

• Buku Logwiritsa Ntchito